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MBCM270F450M270A00 - MBCM270T450M270A00
15.5 RECOMMENDED HEAT SINK PUSH PIN LOCATION
(NO GROUNDING CLIPS)
Notes:
Click here to view original mechanical drawings on the Vicor website.
(WITH GROUNDING CLIPS)
1. Maintain 3.50 (0.138) Dia. keep-out zone
free of copper, all PCB layers.
2. (A) minimum recommended pitch is 39.50 (1.555)
this provides 7.00 (0.275) component
edge-to-edge spacing, and 0.50 (0.020)
clearance between Vicor heat sinks.
(B) Minimum recommended pitch is 41.00 (1.614).
This provides 8.50 (0.334) component
edge-to-edge spacing, and 2.00 (0.079)
clearance between Vicor heat sinks.
15.6 BCM TM MODULE PIN CONFIGURATION
3. V?I Chip TM module land pattern shown for reference
only, actual land pattern may differ.
Dimensions from edges of land pattern
to push–pin holes will be the same for
all full size V?I Chip products.
4. RoHS compliant per CST–0001 latest revision.
5. Unless otherwise specified:
Dimensions are mm (inches)
tolerances are:
x.x (x.xx) = ±0.3 (0.01)
x.xx (x.xxx) = ±0.13 (0.005)
6. Plated through holes for grounding clips (33855)
shown for reference, heat sink orientation and
device pitch will dictate final grounding solution.
4
3
2
1
+Out
-Out
+Out
-Out
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
A
B
C
D
E
H
J
K
L
M
N
P
R
T
+In
TM
RSV
PC
-In
Signal
Name
+In
–In
TM
RSV
PC
+Out
–Out
Designation
A1-E1, A2-E2
L1-T1, L2-T2
H1, H2
J1, J2
K1, K2
A3-D3, A4-D4,
J3-M3, J4-M4
E3-H3, E4-H4,
N3-T3, N4-T4
Bottom View
Rev. 1.1
V?I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
1/2011
Page 18 of 19
v i c o r p o w e r. c o m
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